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2023 LED display buzzword: MIP

Time:2023-11-20 Views:4

According to the official WeChat account of nationstar Optoelectronics, they have recently launched a new transparent substrate MIP (Micro LED in Package) device developed through fan-out packaging technology.


This device selectively arranges an array of target chip using mass transfer technology, and then enlarges the chip electrode pins using redistribution process. Finally, individual devices with single pixel are cut out. Utilizing semiconductor packaging technology, the transparent substrate MIP device exhibits more prominent characteristics in terms of high consistency, high contrast ratio, and high brightness, meeting the application requirements of indoor ultra-high-definition display with a pixel pitch ranging from P0.6 to P0.9.
According to the introduction, this device uses Micro LEDAccording to the introduction, this device uses Micro LED chips with a size of <50um, which reduces material costs. It also adopts a super-thin transparent packaging structure to reduce light loss from the chips and increase brightness by 30%. The chip is surrounded by a matrix-like black wall structure with a black proportion of >99.7%, enhancing the contrast ratio of the module display. The thickness of the device is <150um, combined with the GOB packaging solution, it optimizes the color deviation phenomenon and improves consistency. The use of redistribution technology enlarges the pins, allowing compatibility with a wider PCB spacing and reducing the difficulty of mounting.


It is reported that Jingtai‘s MiP technology belongs to the packaging-level MiP technology, and this packaged MiP can be further packaged as MCOB.


It is worth noting that Jingtai has proposed that "the price of one MiP LED bead equals the price of a set of RGB chips".


In the first three quarters of this year, Jingtai showcased its MiP packaging series products at various exhibitions, including MC1010, MC0606, and MC0404, which can cover a pixel pitch ranging from P0.5 to P1.25.


kinglight MiP products use the needle + laser welding technology, with semiconductor carrier-grade substrates, high precision in chip transfer, more uniform product display, and can be arranged and combined into modules in any combination, providing strong versatility. After being encapsulated as MCOB, it uses optical glue for encapsulation, ensuring good protection against bumps, moisture, and dust.



In April of this year, Leyard highlighted MiPLeyard


In April of this year, Leyard highlighted MiP technology at its 2023 annual strategy conference.


Experts from the industry witnessed Leyard‘s breakthrough in MiP display technology and its new Micro LED products based on MiP technology, including the TXⅡ series, MG series, MGS series, VHC27 series, and smart LED all-in-one machines.


Additionally, Leyard announced its LiJing MiP technology and product planning: MiP0404 - MiP0203 - MiP0202, which will eventually be used to create Micro LED displays with a pixel pitch ranging from 0.4mm to 1.8mm.

Among them, MiP0404 has been put into mass productionAmong them, MiP0404 has been put into mass production and is shipped in the form of a tape. It allows for spectral testing of each individual MiP, eliminating the need for expensive post-correction costs and achieving display consistency.


On July 19th, at InfoComm China 2023, Leyard made a major announcement regarding its new Micro LED product series, including transparent screens and the Black Diamond (MiP) series.


Specifically, Leyard‘s Micro LED transparent screen has a pixel pitch of 0.692mm, utilizing fully flip-chip substrate-free Micro LED chips (20*40um), AM active driving, and COG (glass substrate) technology. It boasts a transparency of 60%, peak brightness of 1500nit, and a viewing angle range of 160-176°.


In addition, Leyard‘s new generation of Micro LED 8K (P0.6) ultra-high-definition display products use Micro LED chips, flip-chip technology, and MiP wire-free packaging processes to achieve mass transfer of light-emitting chips.